status: released drawing: j. glab scale: 2:1 rev: b date: 11/09/07 file: SG-BGA-6249 dwg SG-BGA-6249 drawing modified: 5/19/09 all tolerances: 0.125mm (unless stated otherwise). materials and specifications are subject to change without notice. torque = 0.5 to 1 in-lbs page 1 of 5 18.75mm + ic thickness 32.225 mm 32.225 mm a a ghz bga socket - direct mount, solderless features high speed, reliable elastomer connection compression plate distributes forces evenly ball guide prevents over compression of elastomer minimum real estate required directly mounts to target pcb (needs tooling holes) with hardware. top view side view (section aa) heat sink lid for power dissipation socket base screw: socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. socket base: black anodized aluminum. thickness = 5mm. socket lid screw: shoulder screw, 18-8 ss, 0-80 fine thread. insulation plate: fr4/g10, thickness = 1.59mm. backing plate: black anodized 6061 aluminum. thickness = 6.35mm. heatsink lid: black anodized aluminum. thickness = 18mm. elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). thickness = 0.75mm. elastomer guide: cirlex or equivalent. thickness = 0.725mm. ball guide: kapton polyimide. thickness = 0.25mm. 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 9 8 target pcb bga ic 10 ? 2007 ironwood electronics, inc. 11351 rupp drive, suite 400, burnsville, mn 55337 tele: (952) 229-8200 www.ironwoodelectronics.com
page 2 of 5 recommended pcb layout tolerances: 0.025mm [0.00 1] unless stated otherwise. r e c o m m e n d e d p c b l a y o u t t o p v i e w t a r g e t p c b r e c o m m e n d a t i o n s total thickness: 1.6mm min. plating: gold or solder finish pcb pad height: same or higher than solder mask note: steel backing plate may be required based on end user's application * n o t e : b g a p a t t e r n i s n o t s y m m e t r i c a l w i t h r e s p e c t t o t h e m o u n t i n g h o l e s . status: released drawing: j. glab scale: 3:1 rev: b date: 11/09/07 file: SG-BGA-6249 dwg SG-BGA-6249 drawing modified: 5/19/09 ? 2007 ironwood electronics, inc. 11351 rupp drive, suite 400, burnsville, mn 55337 tele: (952) 229-8200 www.ironwoodelectronics.com backing plate size socket body size orientation mark 1.25mm 0.13mm (x4) 1.25mm 0.13mm (x4) 32.225mm 0.125mm (x4) 5.08mm 2.54mm mounting hole ? 1.61mm 0.05mm (x4) 2.363mm 29.725mm(x4) ? 0.85mm 0.025mm (x2) socket size ? 0.51mmpad 2.738mm* 2.5mm 2.5mm 1mm typ. 34.725mm (x4)
page 3 of 5 status: released drawing: j. glab scale: n/a rev: b date: 11/09/07 file: SG-BGA-6249 dwg SG-BGA-6249 drawing modified: 5/19/09 ? 2007 ironwood electronics, inc. 11351 rupp drive, suite 400, burnsville, mn 55337 tele: (952) 229-8200 www.ironwoodelectronics.com array 26x26 d e y x ?0.25 ?0.10 z x y ?b 3 top view side view 3 4 5 dimensions are in millimeters. interpret dimensions and toleraces per asme y14.5m-1994. dimension b is measured at the maximum solder ball diameter, parallel to datum plame z. datum z (seating plane) is defined by the spherical crowns of the solder balls. parallelism measurement shall exclude any effect of mark on top surface of package. 1. 2. c o m p a t i b l e b g a s p e c 0.20 bottom view dim min max a 2.5 a1 0.4 0.6 b 0.70 d e e 27.00 bsc 27.00 bsc 1.0 bsc e detail f g f g 24.00 bsc 24.00 bsc a a1 detail 0.2 z z 0.20 z 5 4
side view top view 1.59mm 34.725mm 2.5mm 2.5mm 34.725mm 16mm (x4) 10mm sqr. 1.27mm (x4) 29.725mm 0.025mm (x4) 6.35mm insulation plate backing plate note: backing plate holes are tapped to accept 0-80 screws. 5mm 5.03mm ? 1.61mm 0.05mm (x4) page 4 of 5 description: b a c k i n g p l a t e w i t h i n s u l a t i o n p l a t e all dimensions are in mm. all tolerences are +/- 0.125mm. (unless stated otherwise) status: released drawing: j. glab scale: 2:1 rev: b date: 11/09/07 file: SG-BGA-6249 dwg SG-BGA-6249 drawing modified: 5/19/09 ? 2007 ironwood electronics, inc. 11351 rupp drive, suite 400, burnsville, mn 55337 tele: (952) 229-8200 www.ironwoodelectronics.com
page 5 of 5 status: released drawing: j. glab scale: n/a rev: b date: 11/09/07 file: SG-BGA-6249 dwg SG-BGA-6249 drawing modified: 5/19/09 ? 2007 ironwood electronics, inc. 11351 rupp drive, suite 400, burnsville, mn 55337 tele: (952) 229-8200 www.ironwoodelectronics.com socket lid socket base target pcb with smt pads bga package angle wire elastomer socket base screw dowel pin socket base assembly insulation plate backing plate socket lid screw socket (direct mount - hardware) user instructions 1. install the socket base assembly on the target pcb wit h the socket base screws (0.5 in-lb torque per screw). check orientati on of the socket with respect to the target pcb. place insulation pl ate in between target pcb and backing plate. socket base screws w ill thread into the backing plate. 2. place bga package (solder ball side down) into the so cket. note: bga orientation on target pcb is critical. 3. install the socket lid on to the socket base assembly usin g socket lid screws. 4. apply 0.5 in-lb torque per screw on two opposite lid screws. then, apply 1 in-lb torque per screw on the remaining two o pposite lid screws. then, apply 0.5 in-lb torque per screw on the i nitial two lid screws. now, all the lid screws have 1 in-lb torque appli ed in gradual increments. t o o l i n g h o l e s h a v e t o b e d e s i g n e d i n t o t h e t a r g e t p c b f o r t h i s v e r s i o n o f t h e g h z b g a s o c k e t
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